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        第三代
        半導(dǎo)體測(cè)試家族
        Third generation semiconductor testing family
         
        
        
        首頁(yè) 產(chǎn)品中心 Laser Mark Green/Purple series laser marking machines
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        5W/10W/15W pulsed green laser marking machine
        
                             
        The green light laser marking machine adopts international advanced resonant cavity design and laser control technology to achieve excellent beam quality, high long-term working stability, and narrow laser pulse width under high-power operation.
        
                             
         


        

        

        
	
		
        
			
				
        
						 
				
        
				
        
					High electro-optical conversion efficiency and long service life
				
        
			        		
			
				
        
						 
				
        
				
        
					The laser spot output is extremely small and the light pattern is good
				
        
			        		
			
				
        
						 
				
        
				
        
					Laser output power is extremely stable
				
        
			        		
			
				
        
							 
				
        
				
        
					Cold working concept
				
        
			        		
		
        
	        

        
                             
        
                             
        
                                                          
        
                    
        
             
        
    
          
    
        
    

        
	
		
        
			
				Type 
			
			
				5W/10W/15W Pulsed green light laser marking machine
			
		
        
		
        
			
				Advantages 
			
			
				Power management; digital consumer; audio; automotive, energy-saving and environmentally friendly electronics; special or customized IC and wafer testing.
			
		
        
		
        
			
				Introduction 
			
			
				? Laser Marking
        
               ? Laser trimming
        
               ? Thin film photovoltaic cell manufacturing
        
               ? Micromachining
        
               ? PCB, FCP depaneling, cutting and drilling
        
               ? Ceramic and silicon wafer scribing
        
               ? Wafer product marking and cutting
        
               ? LED sapphire substrate substrate
        
               ? Material engraving and cutting of PVC and ABS
        
               ? IC devices, plastic metal frame engraving
        
			        		
		
        
	        

        

        
               
        

   
    
               
  

        Testing standards檢測(cè)標(biāo)準(zhǔn)
              

        
	 

          
                
                
    
        
    
    
    
    
    
    
        
        
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