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        第三代
        半導(dǎo)體測(cè)試家族
        Third generation semiconductor testing family
         
        Double loading fully automatic marking machine

        It is suitable for trough type and stacked magazine turnover, and is an equipment for various laser printing before and after IC lead frame packaging; the equipment consists of two automatic loading and unloading mechanisms, a sheet pushing mechanism, a s



        Suspended power supply

        Multiple sites in parallel

        Multi-channel high precision

        Supports multiple extensions

        Model Double loading fully automatic marking machine
        Product introduction It is suitable for trough type and stacked magazine turnover, and is an equipment for various laser printing before and after IC lead frame packaging; the equipment consists of two automatic loading and unloading mechanisms, a sheet pushing mechanism, a sheet conveying mechanism, a direction detection component, and a two-dimensional It consists of code reading, VISION positioning, double-head laser marking machine, printing detection component, NG collection mechanism, etc. Through parameter adjustment, it can be applied to various IC lead frames of different lengths and widths.
        Features ? This device has the characteristics of large printing range, strong compatibility, high printing accuracy, fast speed and good stability
        ? Suitable for marking blanks in TO, BGA, SOP, QFN, SOT, SOD and other packaging forms


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